| PART |
Description |
Maker |
| BC75-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
| HRC9-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
| BC18-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
| HDG12864F-1 |
Chip On Glass Technology
|
Hantronix,Inc
|
| LEAQ7WP-NXPX-23 |
compact lightsource in SMT technology with glass window on top
|
OSRAM GmbH
|
| ULTRATECH2700 HSH1000UEO |
320 x 240 pixel format, Chip-On-Glass Technology 灯的光刻
CONNECTOR ACCESSORY
Lamps for Photolithography
|
PerkinElmer, Inc.
PerkinElmer Inc.
PerkinElmer Optoelectronics
|
| ML87V3116 |
DOT MAT LCD DSPL CTLR, PQFP176
|
OKI ELECTRIC INDUSTRY CO LTD
|
| 33482-0402 33482-0403 33482-0408 33482-0417 33482- |
MX150 2X2 BLADE SEALED ASSEMBLY MAT SEAL
|
Molex Electronics Ltd.
|
| PIC18F4680 PIC18F2585 PIC18F2585_07 PIC18F2680 PIC |
Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
|
| SC1602P |
5 X 7 DOTS DOT MAT LCD DRVR AND DSPL CTLR, DMA16
|
|
| MSM9000B-XXAV-Z-XX MSM9000B-01AV-Z-XX |
16 X 60 DOTS DOT MAT LCD DSPL CTLR, UUC 35 MM, TCP
|
Oki Electric Industry Co., Ltd.
|
